Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

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Sensing Applications of Atomically Thin Group IV Carbon Siblings Xenes: Progress, Challenges, and Prospects - Khan - 2021 - Advanced Functional Materials - Wiley Online Library

Electrodeposition and characterization of copper nanocone structures

Electrodeposition and characterization of copper nanocone structures

Materials, Free Full-Text

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Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

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